Capabilities
“In our aim for continuous improvement and zero defects we continue to invest in both equipment and personnel for the future.”
Based on Philips placement equipment, DEK screen printers and ESRA reflow ovens, PSL can provide solutions to a wide range of surface mount scenarios.
Surface mount, through hole / surface mount hybrids, fine line, BGA, UBGA, Flexi, Rigid FR4, Ceramic and Metal substrate can be accomodated into our flexible manufacturing process.
Passive devices down to 0201, plus large fine line and BGA packages can be co-resident within the same assembly.
Front-end engineering provides the customer with hard copy verification that re-flow eutectics are within acceptable parameters and that components are not exposed to any form of detrimental thermal shock.
Process control is such that once the initial engineering work has been completed, the repeatability of parameters for on-going production batches is assured to as near as possible 100%.
Stringent process engineering and control enables production using leaded or lead free components or a mixture of both.
